1.What est PCB electroplating?
PCB electroplating refers ad processus depositing a iacuit de metallum onto super superficiem a PCB ad consequi electrica nexu, signum tradenda, calor dissipatio, et alia munera. Traditional DC Electroplating patitur ex rebus ut pauperum coating uniformitatem, insufficiens plating profundum, et ore effectus, faciens illud difficile ad occursum ad vestibulum prostitit provectus PCBBs sicut summus densitate prostitit (HDI) Boards et flexibilibus Excudit Circa (FPC). High frequency Switching Power Victualia Convert Mains ac Power ad High Frequency AC, quae tunc rectificatur et percolantur ad producendum firmum DC vel pulsed current. Eorum operating frequentiis potest pervenire decuros vel etiam centum Kilohertz, longe excedens potentiam frequency (L / 60Hz) de traditional DC potentia commeatibus. High frequentius proprium inducit plures commoda PCB electroplating.
2.Adventages High frequency Switching Power in PCB electroplating
Improved coating uniformitatem: et "cutis effectus" de summus frequency excursus causat current ad incumbo in superficie ad conductor, efficacius effectus. Hoc praecipue utilissimum complexu structurae simile denique lineas et Micro-foramina.
Consectetur altum plating capability: summus frequency excursus potest melius penetrare foraminis muros, augendae crassitiem et uniformitatem plating in medio foramina, quod obvium est ad altum aspect Ratio Vias.
Auxit electroplating Efficens: Fast responsio characteres summus frequency switching potestatem supplete enable magis precise current imperium, reducing plating et augendae productio efficientiam.
Reducitur industria consummatio, summus frequency switching potentia commeatus habent altum conversionem efficientiam et humilis industria consummatio, aligning cum flecte de virens vestibulum.
Pulsus Planta Capitability: High frequency Switching Power Victually potest facile output pulsed current, enabling pulsus electroplating. Plante plating amplio coating qualitas, crescit coating density, reducit porosity et minimizes usum additives.
3.Examples of High frequency Switching Power Supple Applications in PCB electroplating
Aeris Plantis: Aeris Electroplating adhibetur in PCB vestibulum ad formare PROLIXUS iacuit de circuitu. High-frequency switching rectifiers providere precise current densitas, ensuring uniformis aeris iacuit depositione et meliorem qualitas et perficientur de patella iacuit.
B. Superficiem curatio, superficies treatments of PCBBs, ut aurum vel argentum plating, etiam requirere firmum DC potentia. High frequency switching rectam current et intentione pro diversis plating metalla, ensuring lenitate et corrosio resistentia de coating.
C. Chemical Plantis: Chemical Plantis est ferri ex sine current, sed processus est stricte requisitis ad temperatus et current density. High frequency switching rectificia potest providere auxilia potestas ad hoc processus, auxilium ad imperium plating rates.
4.How determinare PCB electroplating potestate copia cubits
In specifications de DC potentia copia requiritur ad PCB electroplating dependet pluribus factoribus, comprehendo genus electroplating processus, PCB magnitudine, plating area, current densitas requisitis, et productionem efficientiam. Infra sunt quidam clavis parametri et communis potestate copia cubits:
A.Current Specifications
● Current Density: De current density pro PCB electroplating typically iugis a 1-10 a / DM² (ampere per quadratum decimeter), fretus in electroplating processus (eg, aeris plating, aurum plating, nickel plating) et coating requisita.
● Summa Current Postulationem: et summa current postulationem est ratione secundum PCB scriptor area et current density. Nam exemplum:
⬛if ad PCB plating area est X DM² et current density est II a / DM², in summa current postulationem esset XX A.
⬛For magna PCBBs aut Missam productio, aliquot centum amperes vel etiam superiore current outputs potest requiri.
Commune current Ranges:
● Parvus PCBs et Laboratory Usus: 10-50 A
● medium-amplitudo PCB productio: 50-200 A
● Magna PCBs et Missam Production: 200-1000 A vel superiore
B.Voltage Specifications
⬛PCB electroplating plerumque requirit inferioribus voltages, typice in range of 5-24 V.
⬛Voltage requisitis dependent factores ut resistentia ad latus balneum, distantia electrodes et conductivity electrolytici.
⬛For specialized processibus (eg, pulsus plating), altior voltage rangis (ut 30-50 V) potest requiri.
Communis voltage Ranges:
● Latin DC electroplating: 6-12 V
● Pulsus plating vel specialioribus processibus: 12-24 V vel altius
Vox copia genera
● DC potentia Supple: Used pro traditional DC electroplating, providing stabile current et intentione.
● Pulsus Vox Supple: propter pulsu electroplating, capax outputting summus frequency pulsed excursus ad amplio plating qualis.
● High-frequency Switching Power Supple: Maximum efficientiam et ieiunium responsum, idoneam ad altus-praecisione electroplating requisita.
C.Power Supple Power
Power potestate potentia (P) determinari a current (i) et voltage (v), cum formula: p = I ×
Exempli gratia, in potentia copia quod outputs C a tempore XII v esset habere potestatem MCC W (1.2 CY).
Power dolor;
● Parvus Equipment: D W - II KW
● medium-amplitudo apparatu: II KW - X kw
● Magna Equipment: X KW - L CW vel altius
Post tempus: Feb-13-2025
